New Counter-Target Sputtering (NFTS) Device
For applications in superconducting thin films and MEMS, it is possible to deposit films on organic substrates with low damage and low-temperature film formation.
The New Facing Targets Sputtering (NFTS) technology is a film deposition technique characterized by its principle and structure that can suppress damage to the deposited substrate caused by the impact of energy species (recoiled particles, ions, electrons) by confining high-density plasma in a box-shaped space. With NFTS technology, it is possible to form high-quality thin films at low temperatures and with low damage, which was considered difficult with conventional sputtering techniques, making it a film deposition technology with high production capabilities. **Features** - **Opposing Target Structure** - Plasma confinement between opposing targets → Suppression of high-energy particles to the substrate → Low-damage film deposition → Suppression of a large number of electrons to the substrate (suppression of Joule heating) → Low-temperature film deposition - **Box-Shaped Plasma Source** - Separation of the vacuum chamber and plasma source → Realization of miniaturization of the entire device through the downsizing of the vacuum chamber → Improved operability and maintainability of the device *For more details, please refer to the PDF document or feel free to contact us.*
- 企業：トヤマ
- 価格：Other
